高柏科技股份有限公司

With the accelerated development cycle of electronic products and the increasing complexity of high-density component design, T-Global Technology offers not only thermal dissipation components to meet various customer needs but also comprehensive thermal engineering solution consulting. We are equipped with the best thermal simulation software and a team of expert thermal engineers to provide preliminary thermal simulation planning and thermal design consulting.

Our thermal simulation solution consulting applies to any electronic product. Simply provide your CAD files (such as SolidWorks, Pro/ENGINEER, STEP, IGES, etc.), and T-Global’s professional team will perform detailed thermal simulation analysis for you, eliminating the time spent on self-modeling. Using advanced thermal technology, our top-tier thermal simulation software supports relay files from all computer graphics software, preserving intricate model details even in complex designs. The result is a high-quality thermal analysis report.

The thermal simulation report enables you to plan the optimal system configuration within your budget. Additionally, the design files you provide will be protected under a confidentiality agreement, ensuring complete security.

By leveraging T-Global's thermal technology expertise and our advanced thermal solutions, you can streamline your product development process and achieve optimal thermal management for your electronic products.

An M.2 SSD Thermal Module is an essential component for maintaining optimal performance and longevity of your solid-state drive. By effectively reducing the operating temperature, it prevents overheating and the risk of thermal throttling, which can significantly impact performance. Heatsinks also play a vital role in extending the lifespan of your M.2 SSD by dissipating heat more efficiently, reducing wear on internal components. Installation is straightforward, with most heatsinks being lightweight and compatible with various SSD models. Beyond functionality, many heatsinks offer sleek designs that enhance the aesthetics of your PC build, making them a valuable addition to any system.

A vapor chamber, sometimes called a flat heat pipe, uses a flat format of two-phase cooling with high heat transfer capability. For electronic cooling applications, the heat energy transfer is usually done on a heat sink very close to the heat source; making the vapor chamber assembly ideal for diffusing high heat density or heat load over a larger surface. By using a vapor chamber, you can expect increased and more uniform heat dispersion, which is ideal for optimizing the performance of the heat sink.The use of vapor chamber has increased significantly because the total power and the resulting power density have increased dramatically as a result of the reduced chip size. In terms of price and application flexibility, today's vapor chambers are more capable and less costly than they were a decade ago.

告别过热！全新M.2 SSD散热模块，稳定效能再升级

在高速储存时代，M.2 SSD 已成为高效能运算的核心，但随着传输速度的提升，过热问题正成为影响效能与寿命的关键挑战。当 SSD 运行于高负载状态时，温度可轻易攀升至 70°C 以上，导致热节流（Thermal Throttling）机制启动，使读写速度下降，甚至影响整体系统稳定性。

面对这一挑战，我们在今日正式推出全新 M.2 SSD 散热模块，透过创新的散热技术，有效降低 SSD 运行温度，确保装置稳定高效运行。根据内部测试数据，该散热模块在连续读写 8GB 数据的高负载环境下，最高温度仅 42°C，相较于未安装散热模块时高达 70°C 的温度，成功降温 40%，显著优于市场上现有产品，解决 SSD 过热导致的效能下降与寿命缩短问题。

M.2 SSD 散热模块采用多重散热优化设计，包括高导热铝合金鳍片、精密堆栈式结构以扩大散热面积，以及内建高效热导管与双层导热贴片，使 SSD 主控芯片与底部散热器紧密贴合，实现极致热传导效率。此外，该模块兼容多种 M.2 2280 SSD，确保安装便利性与广泛适用性。

「我们的目标不仅是提供更强效的散热方案，更要确保用户在高负载环境下，依然能享有稳定、高速的存储体验。」研发团队表示。除了技术创新，我们亦致力于环保永续发展，整个生产过程均符合 RoHS 环保规范，落实企业社会责任。

网通、云端运算、伺服器等高速运算产业，因处理资料和执行复杂计算所产生大量的热能，导致晶片的运算效能下降、资料处理速度减缓，甚至因过热减少产品的寿命，因此需透过散热来维持稳定的工作温度，才可以确保电子元件的运作。

高柏科技致力于提供全方位导热散热材料，针对不断更迭的科技，专制研发解热方案，隆重推出两款领先市场特性的产品，TG-AD30 / TG-AD66 / TG-AD75超软导热矽硅片，导热系数范围涵盖至（3.0-6.5 W/m·K）并且拥有极柔软的质地（Shore OO 20），可在低压下实现完美贴合，轻松填补电子元件与散热器之间的微小空隙。在压缩贴合后，因硅胶片柔软质地产生厚度的变化，更是优化了接触界面，可实现低于0.01 °C*in²/W的热阻性能，能够高效的传递热能，有效的处理电子元件散热的问题，确保晶片稳定工作温度，同时延长产品寿命。