产品简介：TG-AS808 is a thermal paste with 8 W/m·K thermal conductivity it has accumulated years of experience in the research and development of materials for T-Global. In the year 2019, it has launched as a conductive paste, which is also the highest coefficient of thermally conductive paste in the industry. It has good leveling and can effectively fill the unevenness of the metal contact surface. Improve thermal efficiency. Usually used for high-wattage wafers.