产品简介：This hybrid liquid and solid-state thermal conduction putty can effectively fill small and uneven gaps between two surfaces. It has extremely low thermal impedance and greatly improves thermal conduction efficiency. The product does not contain low-molecular-weight siloxane, and will not cause electrical contact failure problems.

It is especially suitable for optical products or mechanisms that contain sensitive electronic components. It is extremely stable and can maintain its excellent thermal conduction properties long-term.