产品简介：额定电流Rated Current:250mA-50A
额定电压Rated Voltage:125VAC24V/32V/36V/48V/63V/72V/125VDC
安全认证Safety Certification:cURus
一、材质Materials
本体Body: 铜Cu，锡Sn，银Ag
基板Substrate:氧化铝陶瓷基板Alumina ceramic
电极Electrode:钢Cu，镍Ni，银Aq，锡Sn
(电极端面镀镍及无铅锡Termination with nickel and Pure.tin solder plating)
二、操作温度Operating Temperature
负55℃to+150℃(考虑温度折减Consider de-rating)
三、可焊性Solderability
熔锡温度T=235℃±5℃，浸锡时间t=2+0-0.5s,
覆盖率Cover≥95%，S=2.0mm±0.5mm,magnifier;20X
四、耐焊接热Resstance toSoldering Heat
熔锡温度T=260℃±5℃，浸锡时间t=10s±1s,S=2.0mm±0.5mm
五、建议焊锡参数Recommended Soldering Parameters
260℃,10s Max(可用于波峰焊和回流焊制程Compatible with both wave and Solder-reflow)